COMMITTEES

TECHNICAL SUBCOMMITTEE CHAIRS

TOPICS:

Reliability of Photovoltaic and Organic devices: Thin Film, concentration, OLED, TFT(New Topic)

Carlos ALGORA 
 ETSIT (Spain)
Roberta CAMPESATO  CESI (Italy)

Quality and Reliability Techniques for Devices and Systems

Christopher BAILEY University of Greenwich (UK)
Marcantonio CATELANI
 University of Firenze (Italy)

Characterisation of Failure Mechanisms: Hot carriers, high K, gate materials

Giuseppe CURRO'  STMicroelectronics (Italy)
Ninoslav D.  STOJADINOVIC  University of Nis (Serbia)

Characterisation of Failure Mechanisms: low K, Cu Interconnects

Cora SALM MESA+ Research Institute/ University of Twente (The Netherlands)
Cher Ming TAN Nanyang Technological University (Singapore)

Characterisation of Failure Mechanisms: ESD, Latch-up

Gianluca  BOSELLI Texas Instruments (USA)
Gernot LANGGUTH  Infineon (Germany)

Advanced Failure analysis: Electron and Optical Beam Testing

Ralph HEIDERHOFF Bergische Universität Wuppertal (Germany)
Paolo SPIRITO University of Napoli (Italy)

Advanced Failure analysis: Other advanced characterisation techniques

Philippe PERDU CNES (France)
Massimo VANZI  University of Cagliari (Italy) 

Failures in Microwave, Wide Band-Gap and Photonic Devices

Nathalie LABAT IMS, University of Bordeaux (France)
Roberto MENOZZI University of Parma (Italy)

Packaging, Assemblies, Passive Components and MEMS

Fabio COCCETTI Novamems/LAAS-CNRS (France)
Augusto TAZZOLI University of Padova (Italy)

Extreme environments: Power, Automotive and industrial applications

Mauro CIAPPA ETH Zürich (Switzerland)
Eckhard WOLFGANG Siemens (Germany)

Extreme environments: Aeronautic and spatial electronics

Jean-Luc LERAY CEA (France)
Alessandro PACCAGNELLA University of Padova (Italy)

STEERING COMMITTEE

X. AYMERICH University of Barcelona (Spain)
L.J. BALK University of Wuppertal (Germany)
J. BISSCHOP NXP (The Netherlands)
M. CIAPPA ETH Zürich (Switzerland)
Y. DANTO IMS (University of Bordeaux (France)
F. FANTINI University of Modena and Reggio Emilia (Italy)
W. GERLING Infineon (Germany)
G. GROESENEKEN IMEC (Belgium)
J.R. LLOYD IBM (USA)
V. LOLL Nokia (Denmark)
L. LONZI ST Microelectronics (Italy)
A.J. MOUTHAAN University of Twente (The Netherlands)
Ph. PERDU
 CNES (France)
N. STOJADINOVIC University of Nis (Yugoslavia)
A. TOUBOUL IMS (University of Bordeaux (France)
W. WONDRAK Daimler Chrysler (Germany)

PROGRAMME COMMITTEE

Conference Chair:

Giovanni BUSATTO DAEIMI, University of Cassino (Italy)

Conference Vice-Chair:

Annunziata SANSEVERINO DAEIMI, University of Cassino (Italy)

Technical Programme Chair:

Fausto FANTINI University of Modena and Reggio Emilia (Italy)
Francesco IANNUZZO DAEIMI, University of Cassino (Italy)
Gaudenzio MENEGHESSO University of Padova (Italy)

Conference Scientific Support:

Giuseppe CURRO' ST Microelectronics Catania (Italy)
Massimo VANZI University of Cagliari (Italy)
Francesco SVELTO ASI - Italian Space Agency Rome (Italy)

Industrial Exhibition:

Carmine ABBATE
 DAEIMI, University of Cassino (Italy)
Antonino PORZIO DAEIMI, University of Cassino (Italy)

Journal Edition Chair:

Giovanni BUSATTO DAEIMI, University of Cassino (Italy)
Francesco IANNUZZO DAEIMI, University of Cassino (Italy)

Organisation Secretariat:

Francesco VELARDI
ESREF 2010 Secretariat
Università degli studi di Cassino
Via di Biasio, 43
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ITALY
Phone: +39 0776 299.4362 - +39 0776 299.4935 - +39 347 610.0869
e-mail: esref2010@unicas.it