TECHNICAL SCOPE
The conference will concentrate on two main areas of interest in
electronics concerning designers, manufacturers and users:
- Strategy for
Quality and Reliability Assessment during Product Development and Life
Cycle
- Advanced Analysis
Techniques for Technologies and Product Evaluation
The Technical Programme Committee selected original papers that address
one
or more of the following topics :
Quality and Reliability
assessment techniques and methods for Devices and Systems
- Design for reliability,
Built-in reliability,
- Virtual qualification,
Reliability simulation,
- Extreme environments,
- Advanced models for
Reliability prediction,
- Reliability test structures,
Limits to accelerated tests,
- Screening methods,
Yield/reliability relationship.
Physical Modeling and
Simulation for Reliability Prediction
- Characterization of defects,
Defect models,
- Numerical simulation,
- Simulation of reliability in
integrated circuits.
Advanced Failure Analysis: Defect Detection and Analysis
- Electron, ion and optical
beam techniques,
- Scanning probe techniques,
- Static or dynamic
techniques, Backside techniques,
- Acoustic microscopy,
- Electric or magnetic field
based techniques
- Electrical, thermal and
thermo-mechanical characterization,
- Sample preparation,
construction analysis,
- Failure analysis: case
studies.
Failure Mechanisms in New Materials and Transistors
- Process-related issues,
Passivation stability,
- Hot carriers injection,
NBTI, TDDB
- High-K dielectrics and gate
stacks,
- Low-K dielectrics and Cu
interconnects,
- ESD-EOS
- Metal migration: mechanical
and thermal aspects,
- Radiation impact on circuits
and systems reliability.
Failure analysis and Reliability of Advanced and Nanoscale electronics
- Non-volatile and
programmable cells,
- Silicon on Insulator devices.
- Wide bandgap semiconductors,
- Microwave and compound
semiconductor devices,
- Photonic devices:
Optoelectronics, lasers and solar cells,
- Optical and NTC
Interconnects,
- MEMS and MOEMS,
- NEMS and nano-objects.
Power Devices Reliability
- Smart-power devices, IGBT,
thyristors,
- High voltage devices,
- Thermal management.
Packaging and Assembly Reliability
- Failure mechanisms and
environmental constraints,
- MCM, CSP, BGA, SiP, WLP,
QFN, advanced PCB,
- Bonding, solders and joints,
Connectors,
- Passive elements.
Photovoltaic Devices and System
Reliability
- III-V Semiconductors,
- Thin Films,
- Concentration PV
Organic
Electron Devices
Reliability
- TFT,
- OLEDs,
- Organic photovoltaic cells
For
further information concerning the scientific programme, please
contact:
Francesco IANNUZZO
Technical programme co-chair
Università degli
studi di Cassino
Via di Biasio, 43
I-03043 CASSINO (FR)
ITALY
Phone: +39 0776 299.4937 - +39 0776 299.3741 - +39 338 4231838
e-mail: esref2010@unicas.it