As
in the tradition of ESREF, several
workshops on the hot fields of the electron devices reliability will be
held during the conference schedule:
- EuFANet Workshop
- EUropean Failure Analysis NETwork workshop on Failure
analysis of
analog devices
(Download here the Call for
papers) Schedule: Wednesday 9.00 - 10.40
- ECPE Workshop
-
European Centre for Power Electronics workshop on Advanced
power module
packaging and reliability testing Schedule: Wednesday 14.10 - 15.40
The annual
"power
devices worshop" is organized by ECPE,
the
European Center for Power Electronics.
Experts
will
discuss with the attendees the following topics:
- Cu bond
wires;
- Ag
sintering
of substrates;
- low
inductance interconnects;
- virtual
reliability testing;
- reliability
testing results;
- reliability
testing
of high temperature power modules;
- nondestructive
SOA testing.
The
workshop will
be moderated by Eckhard Wolfgang, ECPE Nuremberg, and Mauro
Ciappa, ETH Zurich.